收藏本站
I NTEGRATED C IRCUITS D IVISION
XCA170
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
XCA170 / XCA170S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
XCA170 / XCA170S
Maximum Temperature x Time
250oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e 3
R04
www.ixysic.com
5
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
XFG10 EXHAUST GRILL AND FILTERS
XRP6840EVB EVAL BOARD FOR XRP6840
XRP7603EVB EVAL BOARD FOR XRP7603
XRP7604EVB EVAL BOARD FOR XRP7604
XRP7620EVB EVAL BOARD FOR XRP7620
XT374S15 RELAY GEN PURPOSE SPDT 16A 115V
Y0054140K253T29L RES 140.253K OHM .5W .01% AXIAL
REC5-0505SRW/H2/A/M/SMD DC/DC转换器 5W DC/DC 2kV REG 2:1 4.5-9Vin 5Vout
相关代理商/技术参数
XCA170STR 功能描述:固态继电器-PCB安装 Single Pole RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
XC-A1A 制造商:Leach International Corporation 功能描述:EM RLY SPDT 10A 28VDC 500OHM SCKT - Bulk
XC-A1N 制造商:Leach International Corporation 功能描述:EM RLY SPDT 10A 28VDC 500OHM SCKT - Bulk
XCA401DN 功能描述:板上安装压力/力传感器 Asg/Sensym RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides
XCA401GN 功能描述:板上安装压力/力传感器 Asg/Sensym RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides
XCA-401GN 制造商:Grayhill 功能描述:TACT,RA,6X6,1000B,LFGOPERATINGFORCE,RIGHTANGLE - Bulk
XCA405DN 功能描述:板上安装压力/力传感器 3Vto16V 0psi to 5psi Transducer RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides
XCA405GN 功能描述:板上安装压力/力传感器 3Vto16V 0psi to 5psi Transducer RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides